Plastic Blister Pack Vacuum Formed for Components

Product Details
Customization: Available
Surface Resistance: 10e9-10e11 Ohms
Conductive: 10e4-10e6 Ohms
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  • Plastic Blister Pack Vacuum Formed for Components
  • Plastic Blister Pack Vacuum Formed for Components
  • Plastic Blister Pack Vacuum Formed for Components
  • Plastic Blister Pack Vacuum Formed for Components
  • Plastic Blister Pack Vacuum Formed for Components
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Basic Info.

Model NO.
3200
Thickness
0.3-8.0mm
Certification
GS, CCC, RoHS, ISO, CE
Condition
New
Waterproof
Waterproof
Type
Antistatic Agents
Material
PVC/PP
Usage
SMT Production Line, Printing Workshop, Computer Room, Electronic Component Maintenance Room, Combustible & Explosive Area
Transport Package
Custom
Specification
custom
Trademark
LEENOL
Origin
Shanghai
Production Capacity
10000 Perch/Perches Per Week

Product Description

Plastic Blister Pack Vacuum Formed for Components

Details


Material:PS ,PET, PVC,PP
Industrial Use:Electronic
Feature:Recyclable
Custom Order:Accept
Place of Origin:Shanghai, China (Mainland)
Brand Name:Leenol
Model Number:LN-3400 blister packing
Surface resistance:10e9-10e11 ohms
Color:Black
Property:Antistatic/ESD
Thickess:any thickness can be ordered
CAD drawing:available
Customized:width, length, thickness as customer request
Offer Designing:Yes
Thickness:0.3-8.0mm
Conductive:10e4-10e6 ohms
Anti-static:10e9-10e11 ohms
Supply AbilitySupply Ability:
10000 Perch/Perches per Week


Packaging & Delivery

Packaging Details
as blistry size to decide package
Port:shanghai
Lead Time :7-15 working days

ESD blister packing for shipping PCB boards

ESD blister packing tray is made of PS as basic material, it can be made with only black color for conductive type, half-antistatic type etc. It has very good property and the conductive property will not be influenced by any humidity and temperature factors. It is permanent conductive.
 

Material:                                      PS

Thickness:                                  0.3-8.0mm

Appearance:                              black

Customized:                               width and length, thickness as customer request

Conductive:                                10e4-10e6 ohms

Anti-static:                                   10e9-10e11 ohms

Model:                                         3400      

application of blister packing

Disk industries

Semiconductor industries
Electronic product assembly and packaging

This material can be made into IC tray, LCD tray, Electronic Component tray, FPC tray etc. The surface resistance is very stable even after vacuum forming. It has very good property and the conductive property will not be influenced by any humidity and temperature factors.

 

Technical parameter about blister packing

 

Property

Test Method

British System

Value   Unit

Intl. System

Value   Unit

Metric System

Value   Unit

Basic Physical Property

Melt flow rate

ASTM D 1238

2.8   g/10 min

2.8   g/10 min

2.8   g/10 min

Proportion

ASTM D 792

1.05

1.05

1.05

Extrusion molding data

Mechanical Property

Tensile Strength

ASTM D 638

2600       psi

18       Mpa

183     kg/cm2

Breaking Strength

ASTM D 638

2400       psi

17       Mpa

169     kg/cm2

Breaking Elongation

ASTM D 638

40         %

40         %

40         %

Tensile Modulus

ASTM D 790

230000     psi

1600     Mpa

16200   kg/cm2

Notch Impact Strength @23oC

ASTM D 256

1.4     ft-lb/in

75         J/m

8   kg-cm/cm

Thermal Property

Vicat Softening Point

ASTM D 1238

212         oF

100         oC

100       oC

Heat Distortion Temperature @1.8MPa

ASTM D 648

198         oF

92         oC

92       oC

 

 

The picture of blister packing

Plastic Blister Pack Vacuum Formed for Components
Plastic Blister Pack Vacuum Formed for Components
Plastic Blister Pack Vacuum Formed for Components
 

Packaging & Shipping

                   WRAPPAGE             DIEMENTION     PACKAGE TYPE

PACK 1     Paper Cartn                Acc. To Size         kraft paper box

PACK 2     wooden pallet             Acc. To Size          wooden

Exhibition
Plastic Blister Pack Vacuum Formed for Components
Plastic Blister Pack Vacuum Formed for Components




 

FAQ

Q1: What information should we supply if we want a quotation?   

Ans:

  • The material you want to make blister tray
  • Thickness of material
  • The drawing of blister tray
  • If you don't have drawing, please offer your product's drawing, size, let us design a shape of blister tray for you
  • Qty you want

Q2: How long you could prepare samples?

Ans:Normally 3days if we have the sample in hand.

       If customized one, about a week around.

 Q3: How about batch order production?

Ans: normally 3-15days or so

Q4: Do you inspect the finished products?

Ans:Yes, We will do inspection according to ISO 9000 standard and ruled by our QC staff.

Q5: How do you ship the goods?

Ans: by sea, by air, by courier (UPS, DHL, Fedex, TNT etc.)

Q6: What advantage do you have?

Ans:

1. We have professional engineer to support you good solution for your products and design and draw the drawing for your checking.

♥ Related responsible team to answer all your questions and follow-up process for you and do update in time.

♥ Strict and standard process control according to Quality Management System.

Documents support on products, we have strong technical data sheet to support our products, which could make you easier to know our products

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